New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Modulation Characteristics
New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Modulation Characteristics
- Neue Suche nach: Hayashi, T.
- Neue Suche nach: Katsura, K.
- Neue Suche nach: Tsunetsugu, H.
- Neue Suche nach: Hayashi, T.
- Neue Suche nach: Katsura, K.
- Neue Suche nach: Tsunetsugu, H.
Dokumentinformationen
New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Modulation Characteristics
JOURNAL OF LIGHTWAVE TECHNOLOGY LT ; 12 , 11 ; 1963
1994-01-01
1963 pages
Aufsatz (Zeitschrift)
Unbekannt
| DDC: | 621.3692 |
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