New Hybrid Integrated Laser Diode-Drivers Using Microsolder Bump Bonding: SPICE Simulation of High-Speed Modulation Characteristics
JOURNAL OF LIGHTWAVE TECHNOLOGY LT ; 12 , 11 ; 1963
1994-01-01
1963 pages
Aufsatz (Zeitschrift)
Unbekannt
DDC: | 621.3692 |
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