Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes [2691-21]
Plastic-molded package of AlGaInP laser apparatus [2683-07]
Fluxless Sn-Ag solder ball formation for flip-chip application [2691-08]
Optically controlled ultrawideband transceiver [2844-31]
Thermal shift in the exciton absorption maxima as a function of the chip package design [2691-20]
Tunable long-wavelength interdiffused quantum well photodector [2897-505]
16 x 16 Strictly Nonblocking Guided-Wave Optical Switching System
Quality of optical thin films: integrated optics versus optical coating [2891-509]
Multiwavelength DFB Laser Array Transmitters for ONTC Reconfigurable Optical Network Testbed
Error prediction of the Gaussian ML classifier in remotely sensed data [3159-17]
Compact holographic card memory [3010-49]