1–10 von 16 Ergebnissen
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    Plastic ICs for military equipment cost reduction challenge and feasibility demonstration

    Brizoux, M. / Lerose, S. / Chadebec, G. et al. | Tema Archiv | 1990

    Optical data links for automotive applications

    Kibler, T. / Zeeb, E. | Tema Archiv | 2004

    Multichip SMT power package for automotive market

    Paulasto, M. / Wieser, H. / Hauck, T. et al. | Tema Archiv | 2000

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003

    MEMS sensor multi-chip module assembly with TAB carrier pressure belt for aircraft flight testing

    Kim, N.P. / Holland, M.J. / Tanielian, M.H. et al. | Tema Archiv | 2000

    Lead-free solder bumping process for high temperature automotive application

    Teutsch, T. / Blankenhorn, R.G. / Zakel, E. | Tema Archiv | 2003

    ICAs for automotive applications in higher temperature ranges

    Detert, M. / Herzog, T. | Tema Archiv | 1999

    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archiv | 2005