1–16 von 16 Ergebnissen
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    Evolvable hardware: toward morphable, adaptive infrastructures of tomorrow

    Stoica, A. | NTRS | 2000
    Schlagwörter: evolvable hardware smart devices reconfigurable chips MEMS

    NASA Electronic Parts and Packaging (NEPP) Program Plans

    K. A. Label / M. J. Sampson | NTIS | 2016
    Schlagwörter: Chips

    Applied Vertical Bloch Line Storage Technology

    Katti, R. R. | NTRS | 1993
    Schlagwörter: storing data solid-state chips magnetic disks VBL technology

    Automatic Character Detection System for IC Test Handler Based on Active Learning SVM

    Wang, Tianshan / Jiang, Fan / Zhu, Xiaojin et al. | Springer Verlag | 2017
    Schlagwörter: IC chips

    Microfluidic Biochip Design

    C. Panzarella | NTIS | 2004
    Schlagwörter: Chips(Electronics)

    NASA Electrical, Electronic and Electromechanical (EEE) Parts Assurance, An Overview

    K. A. Label / M. J. Sampson | NTIS | 2017
    Schlagwörter: Chips (electronics)

    Overview of NASA Automotive Component Reliability Studies

    M. J. Sampson | NTIS | 2016
    Schlagwörter: Chips (electronics)

    Study of Conformal Coating on Chip-on-Board Technology for Space Applications

    A. G. Darrin / B. Le / J. S. Kadesch | NTIS | 1997
    Schlagwörter: Chips

    Performance Testing of a Microfabricated Propulsion System for Nanosatellite Applications (POSTPRINT)

    A. D. Ketsdever / R. H. Lee / T. C. Lilly | NTIS | 2005
    Schlagwörter: Chips(Electronics)

    1992 4TH NASA SERC Symposium on VLSI Design

    S. R. Whitaker | NTIS | 1992
    Schlagwörter: Chips (Electronics)

    A nonlinear mathematical engine model for the development of dynamic engine control

    Ramli, M.Md. / Morris, A.S. | Tema Archiv | 1991
    Schlagwörter: VLSI CHIPS

    Orbital Impacts and the Space Shuttle Windshield

    K. S. Edelstein | NTIS | 1995
    Schlagwörter: Chips

    Product Assurance Technology for Custom LSI/VLSI Electronics

    M. G. Buehler / B. R. Blaes / G. A. Jennings et al. | NTIS | 1985
    Schlagwörter: Chips (Electronics)

    Vibration-induced fatigue failures in bonding wires used in stacked chip modules

    Leidecker, H. / Hull, S. | Tema Archiv | 1998
    Schlagwörter: gestapelte DRAM-Chips