1–20 von 187 Ergebnissen
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    New approaches to reliability qualification of semiconductor components under varying and progressive stresses

    Hirler, Alexander / Deutschland, Bundeswehr / Eric Cuvillier, Firma | TIBKAT | 2021
    Schlagwörter: Halbleiterbauelement

      New approaches to reliability qualification of semiconductor components under varying and progressive stresses

      Hirler, Alexander / Deutschland, Bundeswehr / Eric Cuvillier, Firma | GWLB - Gottfried Wilhelm Leibniz Bibliothek | 2021
      Schlagwörter: Halbleiterbauelement

    Comparison of the power dissipation with modern semiconductor devices in zero voltage switching

    Mürken, Michael / Pforr, Johannes | Tema Archiv | 2014
    Schlagwörter: Halbleiterbauelement

    Conducted EMI and Systems Integration

    Boroyevich, Dushan / Zhang, Xuning / Bishinoi, Hemant et al. | Tema Archiv | 2014
    Schlagwörter: Halbleiterbauelement

    Joining and package technology for 175 °C Tj increasing reliability in automotive applications

    Dietrich, Peter | Tema Archiv | 2014
    Schlagwörter: Halbleiterbauelement

    Custom power module solutions for automotive traction inverters - the basis for lower cost, higher power density and improved reliability

    Haumann, Siegbert / Olesen, Klaus / Holst, Jörgen | Tema Archiv | 2012
    Schlagwörter: Halbleiterbauelement

    New developments in power electronics

    Cameron, Gary / Hayes, Monty / Lee, Han et al. | Tema Archiv | 2012
    Schlagwörter: Halbleiterbauelement

    Double resonant isolated converter for battery charger with fast switching semiconductors used in hybrid electric shunting locomotive

    De Bernardinis, Alexandre / Butterbach, Stephane / Lallemand, Richard et al. | Tema Archiv | 2012
    Schlagwörter: Halbleiterbauelement

    Design and Evaluation of a 42-V Automotive Alternator With Integrated Switched-Mode Rectifier

    Tang, Sai-Chun / Otten, D.M. / Keim, T.A. et al. | Tema Archiv | 2010
    Schlagwörter: Halbleiterbauelement

    In situ Defect-screening of Integrated LDMOS for Critical Automotive Applications

    Malandruccolo, V. / Ciappa, M. / Fichtner, W. et al. | Tema Archiv | 2010
    Schlagwörter: Halbleiterbauelement

    Novel solution for the built-in gate oxide stress test of LDMOS in integrated circuits for automotive applications

    Malandruccolo, V. / Ciappa, M. / Fichtner, W. et al. | Tema Archiv | 2009
    Schlagwörter: Halbleiterbauelement

    New on-chip screening of gate oxides smart power devices for automotive applications

    Malandruccolo, V. / Ciappa, M. / Rothleitner, H. et al. | Tema Archiv | 2009
    Schlagwörter: Halbleiterbauelement

    Synergies drive growth in traction components market

    Hondiu, Harry | IuD Bahn | 2008
    Schlagwörter: Halbleiterbauelement

    Diesel Locomotive Works: Modernization of EMD locomotives by introduction of IGBT technology

    Bhardwaj, S. M. | IuD Bahn | 2008
    Schlagwörter: Halbleiterbauelement

    Chittaranjan Locomotive Works: A major industrial leader

    Shanker, V. | IuD Bahn | 2008
    Schlagwörter: Halbleiterbauelement

    Styling and design - the real driving forces for LED technology

    Decker, Detlef / Neumann, Cornelius | Tema Archiv | 2008
    Schlagwörter: Halbleiterbauelement

    Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices

    Goroll, Michael / Kanert, Werner / Pufall, Reinhard et al. | Tema Archiv | 2007
    Schlagwörter: Halbleiterbauelement

    Illumination-tolerant vision system aids drivers

    Grenet, Eric | Tema Archiv | 2007
    Schlagwörter: Prozessor (Halbleiterbauelement)