A continuously variable ER damper with energy generation
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
Analysis of Process Errors and Production Yield for Surface Mounted Printed Circuit Assembly
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
Parameter Interactions in Stencil Printing of Solder Paste
The development of electrorheological fluids for an automotive semi-active suspension system
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
Special issue on new advances on formation control of autonomous vehicles
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels
SMT Feeder Slot Assignment for Predetermined Component Placement Paths
Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
Theory of Two-Phonon Processes in Atom-Surface Collision: Application to He + Pt(111) System
Nonexponential Relaxation of Condensed Matter
Critical Dynamics of Diluted Heisenburg Antiferromagnets
Analysing the strategic implications of interconnect technologies