21–40 von 179 Ergebnissen
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    Product End-of-Life Strategy Categorization Design Tool

    Rose, C. M. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    Electronic Products at their End-of-Life: Options and Obstacles

    Linton, J. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Framework for the Flexible Grouping of Products for Disassembly

    Viswanathan, S. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    A Study on Wettability and Defects Behavior of Flow-Soldered Joint Using Low Residue Flux

    Choi, M. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Efficient Heuristics for Drilling Route Optimization in Printed Circuit Board Manufacturing

    Linn, R. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Solder Paste Tests for the 'AART' Process

    Murthy, S. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    The Singapore and Malaysia Electronics Industries : D. Beane, A. Shukla and M. Pecht (Book review)

    Tilley, K. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Design Efficiency for the Disassembly of Modular Electronic Products

    Veerakamolmal, P. | Online Contents | 1999
    Verlag: World Scientific , Singapore

    SMT Compatible No-Flow Underfill for Solder Bumped Flip Chip on Low-Cost Substrates

    Lau, J. H. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Finite Element Modeling of Heat Transfer in Chip on Tape Packages

    Yang, L. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Modeling of Acid Copper Electroplating : A Review

    Poon, G. K. K. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly

    Baldwin, D. F. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore