0.1 mu m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology
3-layered 3D flex based MCM: electrical characterization and reliability issues
Accelerated testing of flip chip packages under dynamic load
Acoustic and random vibration test tailoring for low-cost missions
Acoustics of UH-60 black hawk with growth rotor blades
Active approach for holographic nondestructive testing of satellite fuel tanks
A decision support system for fuzzy scheduling of software projects
Adhesive bonding and lightweight structures in shipbuilding
A distributed decision support system for operational units application to a manufacturing unit
Advanced IGBT modules for railway traction applications: Reliability testing
Ageing testing procedures on lithium batteries in an international collaboration context
ALLADIN - state of the art to assemble, to integrate and to test most complex airborne systems
Alternative solders for flip chip applications in the automotive environment
A methodology for POD determination incorporating insight from physical models
A new Ag/Pd conductor for automotive applications
An experimental study of 2-D mixer/ejector noise and thrust characteristics