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Halbleiterbauelement
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keywords:("Halbleiterbauelement")
X-by-Wire: Opportunities, Challenges and Trends
Plastic Ball-Grid-Arrays (PBGA): Are they ready for environmentally harsh Aerospace applications?
Power electronics reliability in rail traction
A lightweight 8-14 micrometer thermal imager
In-house Testing of Highly Hardware-dependent Software
Unique Variable Reluctance System for Improved Noise Immunity
FPGA Considerations for Automotive Applications
Power Saving in Body Applications at High Temperatures