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    Thermal stress analysis of heat-activated coupling of composite-to-composite pipe

    Thermal stress analysis of heat-activated coupling of composite-to-composite pipe


    An investigation of thermal stress in the coupling of heat-activated joined E-glass/Epoxy composite-to-composite piping has been conducted. Residual thermal stress induced by temperature change after the fabrication process of the pre-impregnated E-glass/Epoxy used to couple the pipes was investigated experimentally and simulated numerically using finite element methods. A parametric study was also conducted to analyze the influence of coupling thickness on the residual curing stress. Precursory results obtained from conducted experiments compares favorably with results obtained from the finite element analysis. This study is pertinent in determining the magnitudes of thermal stress in the joint in order to design for the necessary factor of safety.

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    Titel :

    Thermal stress analysis of heat-activated coupling of composite-to-composite pipe

    Beteiligte:
    Mensah, P.F. (Autor:in) / Zhao, Yi (Autor:in) / Stubblefield, M.A. (Autor:in) / Pang, Su-Seng (Autor:in)
    Erschienen in:

    ASME Energy Sources Technology Conference, 1999

    ASME/PD

    Erscheinungsdatum :

    1999

    Format / Umfang :

    Seiten

    Medientyp :

    Aufsatz (Konferenz)

    Format :

    Datenträger

    Sprache :

    Englisch

    Schlagwörter :

    Verbundbauteil , Wärmespannung , faserverstärkter Werkstoff , Glasfaser , Finite-Elemente-Methode , Rechnersimulation , Eigenspannung , Rohrleitungsverbindung , Spannungsanalyse , Klebverbindung , Pipeline , Unterwasserrohrleitung

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