TAB interconnect in high performance ceramic packages for military applications
TAB interconnect in high performance ceramic packages for military applications
- Neue Suche nach: Gould, N.
- Neue Suche nach: Ewanich, J.
- Neue Suche nach: Callahan, R.
- Neue Suche nach: Gould, N.
- Neue Suche nach: Ewanich, J.
- Neue Suche nach: Callahan, R.
The use of fine pitch TAB interconnect in high performance ceramic packages designed to meet military standards poses unique problems not associated with general TAB applications. These problems include designing around the tolerances inherent to multilayer ceramic package manufacturing technologies, the ability to withstand the IC package assembly processes, and meeting stringent military requirements on the finished product. This paper discusses 4.1 mil (104 micrometer) pitch inner lead bond (ILB) and outer lead bond (OLB) TAB interconnect in a ceramic pin grid array custom designed for a 484 pad high performance ECL integrated circuit.
Dokumentinformationen
TAB interconnect in high performance ceramic packages for military applications
TAB-Verbindungen in keramischen Hochleistungsgehäusen für militärische Anwendungen
1992
10 Seiten, 3 Bilder, 4 Tabellen
Aufsatz (Konferenz)
Englisch
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