This paper deals with the development of a new thermoplastic substrate for printed circuit board based on high temperature thermoplastics. The main goal is to replace high frequency substrates, based on teflon or epoxy resins. The advantages of such thermoplastic substrates are the continuous fabrication with twinscrew extrusion machines (direct film extrusion/injection moulding) and the copper lamination without any adhesive. Because of the inherent flame retardant of the used thermoplastic PCBs the V0 status is fulfilled without any chemical additives. First demonstrators are developed, for example a 4 layer PCB and a hybrid PCB (FR4 combined with the new substrate material). Especially in the case of the aviation and high performance substrates the new substrate exhibits significant cost advantages. The paper deals with the fabrication process of the substrate, the thermal, mechanical, dielectrical properties and the lamination process.
Development of a thermoplastic printed circuit board for high performance applications in the aviation industry
2010
12 Seiten, 13 Bilder, 2 Tabellen, 17 Quellen
Aufsatz (Konferenz)
Englisch
gedruckte Schaltung , Hochleistung , Flugzeugindustrie , Hochtemperatur , Hochtemperaturbeständigkeit , Doppelschneckenextruder , Folienextrusion , Spritzgießverfahren , kontinuierliche Arbeitsweise , Kupfer , Laminieren (Mehrschichtstoff) , PCB (polychloriertes Biphenyl) , Schichtstruktur , thermische Eigenschaft , dielektrische Eigenschaft
Development of a thermoplastic printed circuit board for applications in the aviation industry
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