Development of a thermoplastic printed circuit board for high performance applications in the aviation industry

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Development of a thermoplastic printed circuit board for high performance applications in the aviation industry

Apeldorn, T. / Wolff Fabris, F. / Altstädt, V. / Lühnen, O. / Hörhold, A. / Ranocha, K.

This paper deals with the development of a new thermoplastic substrate for printed circuit board based on high temperature thermoplastics. The main goal is to replace high frequency substrates, based on teflon or epoxy resins. The advantages of such thermoplastic substrates are the continuous fabrication with twinscrew extrusion machines (direct film extrusion/injection moulding) and the copper lamination without any adhesive. Because of the inherent flame retardant of the used thermoplastic PCBs the V0 status is fulfilled without any chemical additives. First demonstrators are developed, for example a 4 layer PCB and a hybrid PCB (FR4 combined with the new substrate material). Especially in the case of the aviation and high performance substrates the new substrate exhibits significant cost advantages. The paper deals with the fabrication process of the substrate, the thermal, mechanical, dielectrical properties and the lamination process.

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Dokumentinformationen

Titel :

Development of a thermoplastic printed circuit board for high performance applications in the aviation industry

Beteiligte:

Apeldorn, T. (Autor:in) / Wolff Fabris, F. (Autor:in) / Altstädt, V. (Autor:in) / Lühnen, O. (Autor:in) / Hörhold, A. (Autor:in) / Ranocha, K. (Autor:in)

Erschienen in:

Polymers in Defense & Aerospace Applications, 2 ; 1-12

Erscheinungsdatum :

2010

Format / Umfang :

12 Seiten, 13 Bilder, 2 Tabellen, 17 Quellen

ISBN :

978-1-84735-398-6

Medientyp :

Aufsatz (Konferenz)

Format :

Sprache :