Novel component packaging for high current applications using power semiconductor devices

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Novel component packaging for high current applications using power semiconductor devices

Weigeber, Volker / Hayes, Montry B. / Campbell, Robert J. / Fruth, John R. / Gerbsch, Erich W.

With the recent advances in power semiconductor technology, there has been a need to develop complementary cost effective packaging solutions that are capable of operating in demanding automotive environments for HEV, PHEV, FCV and EV applications. To fulfil this need, novel component packages have been developed for power semiconductor devices which eliminate wirebonds as an interconnect technology. These packages are the first in the Scorpion and Viper family of electrically isolated Power MOSFET and IGBT/Diode packages, which were developed to utilize the latest in semiconductor device technologies. The new packages provide low electrical and thermal impedances, are individually testable, and provide the capability to provide both single and dual sided component cooling. Due to their unique design and the elimination of wirebonds, the packages allow much higher and more uniform current densities through the device as compared to industry standard packages of similar size. This combined with a CTE matched thermal stackup allows for a highly reliable component, which can be easily manufactured using standard low cost high volume manufacturing. The packages can be used in a wide variety of environmentally demanding PWM applications, including DC/DC converters, inverters and other applications requiring high current, high power devices. This paper presents the design, provides test results, and gives an example of their use in a traction inverter hybrid vehicle application.