A unified approach to solder joint life prediction
A unified approach to solder joint life prediction
A unified approach has been developed and applied to solder joint life prediction in this paper, which indicates a breakthrough for solder joint reliability simulation. It includes the material characterization of solder alloys, the testing of solder joint specimens, a unified viscoplastic constitutive framework with damage evolution, numerical algorithm development and implementation, and experimental validation. This paper is to finalize the unified approach and present simulation results by numerical implementation of the nonlinear algorithm. Some experimental verification tests are also presented, including the laser moire measurement of solder joint deformation under cyclic loading. An alternative and simple implementation of the constitutive framework without damage evolution and kinematical hardening has shown its significance in the life prediction of Flip-chip packages.
Dokumentinformationen
A unified approach to solder joint life prediction
Eine vereinheitlichte Näherung zur Vorhersage der Lebensdauer von Lötverbindungen
2000
8 Seiten, 20 Bilder, 20 Quellen
Aufsatz (Konferenz)
Englisch
Ähnliche Titel
A Unified Approach to Solder Joint Life Prediction
| SAE Technical Papers | 2000
A unified approach to solder joint life prediction
| Kraftfahrwesen | 2000
A Unified Approach to Solder Joint Life Prediction
| British Library Conference Proceedings | 2000
A Unified Approach to Turbine Blade Life Prediction
| SAE Technical Papers | 1982
Solder Life Prediction for Leadless Chip Carriers
| British Library Conference Proceedings | 1992