Thermal stresses are caused by a mismatch in the thermal expansion characteristics of the materials in assemblies. Long-term degradation caused by cyclic thermal stresses results in fatigue-type failures in the assemblies. This article is mainly concerned with the design of the accelerated-life tests which are intended to simulate these cyclic thermal stresses for reliability studies.
Understanding cyclical thermal stress in electronic assemblies: The key to improving accelerated-life testing
Verstaendnis fuer zyklische thermische Spannungen in Elektronik-Baugruppen ist der Schluessel zur Verbesserung der Lebensdauerpruefung im Kurzzeit-Versuch.
Insulation Circuits ; 21 , 11 ; 49-56
1975
8 Seiten, 12 Bilder, 13 Quellen
Aufsatz (Zeitschrift)
Englisch
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