This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.
GOLD PLATING For Electronic and Electrical Applications
1980-10-15
Aufsatz (Konferenz)
Englisch
Metals , Test procedures , Quality standards , Copper , Conductivity , Heat treatment , Parts , Plating , Mountings , Copper alloys
GOLD PLATING For Electronic and Electrical Applications
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