Modeling and Analysis of Helical and Wave Spring Behavior for Automobile Suspension

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Modeling and Analysis of Helical and Wave Spring Behavior for Automobile Suspension

Rajaram Ganesan, Girish Vishnu / Nandhagopal, Jayasuriya / Kuppuraj, Sathishkumar / Ranganathan, Soundararajan

The suspension is an indispensable element of automobiles which plays a crucial role in maintaining stability and the ride comfort. Helical springs are used in automobile suspension for many decades. The stiffness of the spring and presence of shock absorber plays a major role while negotiating a huge amount of load. Therefore, the cost of the suspension increases proportionally in commercial vehicles. In this present work, a helical and wave spring is designed and static cum dynamic analysis is done by using ANSYS 18.1 for comparing their performance and to eliminate the downside of the suspension. The geometry of the helical spring is designed using the helix curve and wave spring is designed using Sinusoidal equation. Modeling of both the springs is done using Solid works 2018. Chrome silicon and music wire are chosen as a spring material. The responses like stress and deflection of helical spring and wave spring for both the materials under static loads of 3000 N, 3500 N, 4000 N is obtained. Further, the dynamic analysis is conducted on both the springs under transient load conditions to obtain their responses. Output results such as total deformation and von-misses are taken in each loading condition, and the responses are compared. The results show that wave spring of chrome silicon has better properties in both static and dynamic load conditions. From the analysis, it is concluded that the use of helical spring with shock absorber system can be replaced by the newly developed chrome silicon wave spring suspension system. Due to this system incorporation in the vehicles, the free length is reduced.

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Dokumentinformationen

Titel :

Modeling and Analysis of Helical and Wave Spring Behavior for Automobile Suspension

Weitere Titelangaben:

Sae Technical Papers

Beteiligte:

Rajaram Ganesan, Girish Vishnu (Autor:in) / Nandhagopal, Jayasuriya (Autor:in) / Kuppuraj, Sathishkumar (Autor:in) / Ranganathan, Soundararajan (Autor:in)

Kongress:

International Conference on Advances in Design, Materials, Manufacturing and Surface Engineering for Mobility ; 2019

Erschienen in:

Sae Technical Paper Series

Erscheinungsdatum :

2019-10-11

ISSN :

2688-3627 , 0148-7191

DOI :

https://doi.org/10.4271/2019-28-0130

Medientyp :

Aufsatz (Konferenz)