A unique heat exchanger has been developed with potential applications for cooling high power density electronics and perhaps high energy laser mirrors. The device was designed to absorb heat fluxes of approximately 50 w/cm2 (158,000 Btu/hr.ft2) with a low thermal resistance, a high surface temperature uniformity and very low hydraulic pumping power. A stack of thin copper orifice plates and spacers was bonded together and arranged to provide liquid jet impingement heat transfer on successive plates. This configuration resulted in effective heat transfer coefficients, based on the prime surface, of about 85,000 w/m2 °C (15,000 Btu/hr.ft2 °F) and 1.8 watts (.002 HP) hydraulic power with liquid Freon 11 as coolant.


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    Titel :

    A Compact High Intensity Cooler (CHIC)


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Parekh, M. B. (Autor:in) / Niggemann, R. E. (Autor:in) / Bland, T. J. (Autor:in)

    Kongress:

    Intersociety Conference on Environmental Systems ; 1983



    Erscheinungsdatum :

    1983-07-11




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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