Copper-water heat pipes are commonly used for thermal management of electronics systems on earth and aircraft, but have not been used in spacecraft thermal control applications to date, due to the satellite industry's requirement that any device or system be successfully tested in a microgravity environment prior to adoption. Recently, Advanced Cooling Technologies Inc., (ACT), NASA Marshall Space Flight Center, and the International Space Station office at NASA's Johnson Space Center demonstrated flight heritage in Low-Earth Orbit. The testing was conducted aboard the International Space Station (ISS) under the Advanced Passive Thermal eXperiment (APTx) project. The heat pipes were embedded in a high conductivity (HiK "TM") aluminum base plate and subject to a variety of thermal tests over a temperature range of -10 to 38 C for a ten-day period. Results showed excellent agreement with both predictions and ground tests. In addition, novel hybrid wick aluminum-ammonia heat pipes are developed to handle heat flux requirements for spacecraft thermal control applications. The 5-10 W/cm2 heat density limitation of aluminum-ammonia grooved heat pipes has been a fundamental limitation in the current design for space applications. The recently demonstrated 50W/cm2 capability of the hybrid high heat flux heat pipes provides a realistic means of managing the high heat density anticipated for the next generation space designs.


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    Titel :

    Copper-Water and Hybrid Aluminum-Ammonia Heat Pipes for Spacecraft Thermal Control Applications



    Kongress:

    International Heat Pipe Conference (IHPC) ; 2018 ; Pisa, Italy
    International Heat Pipe Symposium (IHPS) ; 2018 ; Pisa, Italy


    Erscheinungsdatum :

    2018-06-10


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :


    Copper-Water and Hybrid Aluminum-Ammonia Heat Pipes for Spacecraft Thermal Control Applications

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    Cryogenic heat pipes in spacecraft applications

    PETERSON, G. / COMPAGNA, G. | AIAA | 1986