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    Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules

    Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules


    Utilization of optical links must fit current packaging scenarios in electrical systems. Due to interboard spacing in electrical system racks, optical interconnects must go though a right angle turn to reach the backplane which is commonly the case in the manufacture of VCSEL optoelectronic module. VCSEL reliability is also an issue in hampering its utilization. Increasing data rate in VCSEL entails increasing current density which reduces reliability. The talk offers a detailed discussion on the packaging, and reliability and failure of VCSELs.

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    Titel :

    Fitting optical interconnects to an electrical world-packaging and reliability issues of arrayed optoelectronic modules

    Beteiligte:
    Goossen, K.W. (Autor:in)
    Erschienen in:

    The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004. ; 2 ; 653-654 Vol.2

    Erscheinungsdatum :

    2004-01-01

    Format / Umfang :

    129232 byte

    ISBN :

    0-7803-8557-8

    DOI :

    https://doi.org/10.1109/LEOS.2004.1363408

    Medientyp :

    Aufsatz (Konferenz)

    Format :

    Elektronische Ressource

    Sprache :

    Englisch

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