This disclosure discloses a power adapter and an electronic device system, and relates to the field of heat dissipation technologies. The power adapter includes a housing, a printed circuit board assembly, and insulation powder filled in the housing. The printed circuit board assembly is fastened in the housing, and the insulation powder is used to conduct heat generated by the printed circuit board assembly to the housing. Compared with a thermally conductive adhesive, the insulation powder does not have a problem of poor fluidity, and can more easily be sufficiently filled. This solution improves heat dissipation effect of the power adapter and helps further increase a charging power of the power adapter.
POWER ADAPTER AND ELECTRONIC DEVICE SYSTEM
2024-03-21
Patent
Elektronische Ressource
Englisch
IPC: | H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER , Schaltungsanordnungen oder Systeme für die Abgabe oder Verteilung elektrischer Leistung |
ADAPTER, ELECTRONIC DEVICE, AND METHOD FOR TRANSPORTING ELECTRONIC DEVICE
Europäisches Patentamt | 2021
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