제1 금속 판(1), 제2 금속 판(2) 및 상기 제1 금속 판과 제2 금속 판사이에 삽입된 음향 절연 층(3)을 포함한 적층 구조 패널을 제조하기 위한 방법. 상기 제1 금속 판 및 제2 금속 판은 적층 구조 패널위에 분포되고 상기 음향 절연 층의 영역을 통해 연장되며 국소적으로 용접된 다수의 조인트들에 의해 서로 연결된다. 용접된 상기 조인트들은 스터드 용접에 의해 형성되고, 상기 금속판들 중 한 개는 용접 개구부들을 가지며, 용접핀(7)이 상기 절연층을 통해 다른 금속판에 대해 가압된다. 또한 상기 용접된 조인트는 스폿 용접에 의해 형성될 수 있고, 금속판들은 스폿 용접 장비와 전기적으로 연결되며, 상기 금속판들은 서로를 향해 가압되어 상호 전기적 접촉이 형성된다.

    A method for manufacturing a laminar construction panel comprising a first (1) and a second (2) metal plate and an acoustic insulation layer (3) interposed there between. The first and second metal plates are connected to each other by a number of locally welded joints distributed over the laminar construction panel and extended through an area of an acoustic isolation layer. The welded joints are formed by stud welding, one of the metal plates is provided with welding openings (4), and a welding pin (7) is pushed through the isolation layer against the other metal plate. The welded joints may be formed by spot welding, both metal plates are brought into electrical connection with the spot welding equipment, and the metal plates locally are pressed toward each other in such a way that mutual electrical contact is made.


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    Titel :

    METHOD FOR MANUFACTURING A LAMINAR CONSTRUCTION PANEL


    Weitere Titelangaben:

    적층 구조 패널을 제조하기 위한 방법


    Beteiligte:
    SMITS SANDER (Autor:in)

    Erscheinungsdatum :

    2016-06-07


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    B63B Schiffe oder sonstige Wasserfahrzeuge , SHIPS OR OTHER WATERBORNE VESSELS / B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / E04B Allgemeine Baukonstruktionen , GENERAL BUILDING CONSTRUCTIONS / E04C STRUCTURAL ELEMENTS , Bauelemente



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