This bonded structure includes a first member having a metal portion and a film portion disposed on at least a part of a surface of the metal portion; a second member; an adhesive layer for joining the first member and the second member to each other via the film portion. The film portion contains a resin and inorganic particles. The inorganic particles are formed of ferrosilicon or non-oxide ceramics containing V. Some of the inorganic particles protrude toward the adhesive layer. The particle size of at least some of the inorganic particles protruding toward the adhesive layer is less than the film thickness of the film portion.


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    Titel :

    接着接合構造体および自動車用部品


    Erscheinungsdatum :

    2021-12-22


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Japanisch


    Klassifikation :

    IPC:    B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM , Schichtkörper, d.h. aus Ebenen oder gewölbten Schichten, z.B. mit zell- oder wabenförmiger Form, aufgebaute Erzeugnisse / B62D MOTOR VEHICLES , Motorfahrzeuge / C23C Beschichten metallischer Werkstoffe , COATING METALLIC MATERIAL