Titel :

DBC substrate based EMC Transfer Molded Power Module

Beteiligte:

Lee, K.H. (Autor:in) / Jeon, O.-S. (Autor:in) / Lim, S.-W. (Autor:in) / Park, S.-M. (Autor:in) / Lee, B.-O. (Autor:in) / Lee, T.-K. (Autor:in) / VDE; European Center for Power Electronics

Kongress:

5th, International conference on integrated power electronics systems ; 2008 ; Nuremberg, Germany

International conference on integrated power electronics systems ; 59-66

ETG FACHBERICHT ; 111

Erscheinungsdatum :

2008-01-01

Format / Umfang :

8 pages

Anmerkungen:

Also held on CD-ROM

ISBN :

9783800730896

ISSN :

0341-3934

Medientyp :

Aufsatz (Konferenz)

Format :

Print

Sprache :

Englisch

Schlagwörter :

Integrated power electronics systems , CIPS , Power electronics systems , Integrated power systems

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