Titel :

High-speed 3D inspection system for solder bumps [2597-22]

Beteiligte:

Tsukahara, H. (Autor:in) / Nishiyama, Y. (Autor:in) / Takahashi, F. (Autor:in) / Fuse, T. (Autor:in) / Batchelor, B. G. / Solomon, S. S. / Waltz, F. M. / SPIE

Kongress:

Conference, Machine vision applications, architectures, and systems integration IV ; 1995 ; Philadelphia; PA

Machine vision applications, architectures, and systems integration IV ; 2597 ; 168-177

PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING ; 2597

Erscheinungsdatum :

1995-01-01

Format / Umfang :

10 pages

ISBN :

0819419613

ISSN :

0361-0748

Medientyp :

Aufsatz (Konferenz)

Format :

Print

Sprache :

Englisch

Schlagwörter :

machine vision applications , architectures , systems integration , SPIE

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